The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2019

Filed:

Jun. 25, 2014
Applicant:

Itm Semiconductor Co., Ltd, Chungcheongbuk-do, KR;

Inventors:

Hoseok Hwang, Gyeonggi-do, KR;

Youngseok Kim, Chungcheongbuk-do, KR;

Sunghee Lee, Gyeonggi-do, KR;

Seongbeom Park, Gyeonggi-do, KR;

Sanghoon Ahn, Chungcheongbuk-do, KR;

Taehwan Jeong, Chungcheongbuk-do, KR;

Seunguk Park, Chungcheongnam-do, KR;

Jaeku Park, Chungcheongbuk-do, KR;

Younggeun Yoon, Chungcheongbuk-do, KR;

Hyunsuck Lee, Chungcheongbuk-do, KR;

Sunghee Wang, Jeollanam-do, KR;

Assignee:

ITM SEMICONDUCTOR CO., LTD., Chungcheongbuk-do, KR;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01M 2/34 (2006.01); H01M 10/42 (2006.01); H01M 2/02 (2006.01); H02H 7/18 (2006.01); H01M 10/052 (2010.01);
U.S. Cl.
CPC ...
H01M 2/348 (2013.01); H01M 10/425 (2013.01); H02H 7/18 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/49111 (2013.01); H01L 2924/19105 (2013.01); H01M 2/021 (2013.01); H01M 2/0212 (2013.01); H01M 10/052 (2013.01); H01M 2200/106 (2013.01); H01M 2220/30 (2013.01);
Abstract

Provided are a battery protection circuit module package capable of achieving high integration and size reduction, and a battery pack and an electronic device including the same. The battery protection circuit module package includes a lead frame including a plurality of leads space apart from each other, and capable of being coupled and electrically connected to electrode tabs of a battery cell, battery protection circuit devices mounted on the lead frame and including a positive temperature coefficient (PTC) structure, and an encapsulant for encapsulating the battery protection circuit devices to expose a part of the lead frame.


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