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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10263159 B1

PDFFull Text
Date of Patent:
Apr. 16, 2019

Filed:

Feb. 23, 2016

Light-emitter mounting package, light-emitting device, and light-emitting module

Applicant:

Kyocera Corporation, Kyoto-shi, Kyoto, JP;

Inventors:

Kenjirou Fukuda, Kyoto, JP;

Kensaku Murakami, San Diego, CA (US);

Kouichi Kawasaki, Kyoto, JP;

Assignee:

KYOCERA CORPORATION, Kyoto, JP;

Attorney:

Volpe and Koenig, P.C.

Primary Examiner:

Jose R Diaz

Int. Cl.
CPC ...
H01L 33/60 (2010.01); H01L 33/46 (2010.01); H01L 33/48 (2010.01); H01L 33/54 (2010.01); H01L 33/62 (2010.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
H01L 33/46 (2013.01); H01L 33/486 (2013.01); H01L 33/54 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 33/641 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/181 (2013.01); H01L 2933/0058 (2013.01);
Abstract

A light-emitter mounting package includes an insulating base, a wiring conductor, and a metal layer. The insulating base has a main surface including a recess in which a light emitter is mountable. The wiring conductor is arranged on a peripheral portion of a bottom surface of the recess that is adjacent to an inner wall of the recess. The insulating base has a side surface including a sloping surface adjacent to the main surface. The metal layer is spaced from the wiring conductor, and extends on the inner wall of the recess, the main surface, and the sloping surface.

Find Patent Forward Citations

Fukuda, Kenjirou. (2019). Light-emitter mounting package, light-emitting device, and light-emitting module (U.S. Patent No. 10263159). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10263159

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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