The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2019

Filed:

Dec. 29, 2017
Applicant:

Sony Corporation, Tokyo, JP;

Inventors:

Takashi Abe, Kanagawa, JP;

Nobuo Nakamura, Kanagawa, JP;

Keiji Mabuchi, Kanagawa, JP;

Tomoyuki Umeda, Kanagawa, JP;

Hiroaki Fujita, Kanagawa, JP;

Eiichi Funatsu, Tokyo, JP;

Hiroki Sato, Kanagawa, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 23/544 (2006.01); H01L 31/0216 (2014.01); H01L 31/0232 (2014.01);
U.S. Cl.
CPC ...
H01L 27/14643 (2013.01); H01L 23/544 (2013.01); H01L 27/1462 (2013.01); H01L 27/1463 (2013.01); H01L 27/1464 (2013.01); H01L 27/14603 (2013.01); H01L 27/14607 (2013.01); H01L 27/14609 (2013.01); H01L 27/14612 (2013.01); H01L 27/14623 (2013.01); H01L 27/14625 (2013.01); H01L 27/14627 (2013.01); H01L 27/14632 (2013.01); H01L 27/14636 (2013.01); H01L 27/14683 (2013.01); H01L 27/14685 (2013.01); H01L 27/14687 (2013.01); H01L 31/0232 (2013.01); H01L 31/02162 (2013.01); H01L 31/02327 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54453 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Forming a back-illuminated type CMOS image sensor, includes process for formation of a registration mark on the wiring side of a silicon substrate during formation of an active region or a gate electrode. A silicide film using an active region may also be used for the registration mark. Thereafter, the registration mark is read from the back-side by use of red light or near infrared rays, and registration of the stepper is accomplished. It is also possible to form a registration mark in a silicon oxide film on the back-side (illuminated side) in registry with the registration mark on the wiring side, and to achieve the desired registration by use of the registration mark thus formed.


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