The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2019
Filed:
Nov. 07, 2017
Kaijo Corporation, Tokyo, JP;
Akio Sugito, Tokyo, JP;
KAIJO CORPORATION, Tokyo, JP;
Abstract
[Problem] To provide a bonding device capable of adequately controlling a leading end of a capillary when a ball formed at a leading end of a wire is pressed and bonded to an electrode of a semiconductor chip with scrub vibration. [Solution] The bonding device is provided with a vibration driving portion (), the vibration driving portion () including a plurality of piezoelectric elements () that are expanded and contracted along an axial direction of a bonding arm () respectively with one end thereof fixed to a leading end of the bonding arm (), a plurality of capillary holding portions () that are in contact respectively with a circumferential face of a capillary () at a base end side thereof as being fixed correspondingly to the other end of the piezoelectric elements (), and a pressing-holding portion () that sandwiches the capillary () as pressing the capillary () to the capillary holding portions () with at least one end side fixed to the bonding arm () and the other end side being in contact with the circumferential face of the capillary () at the base end side thereof on a side opposite to the capillary holding portions (). Here, functional operation of amplitude, phase, frequency, or waveform is performed on drive voltage waveform to the respective piezoelectric elements.