The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2019

Filed:

Aug. 29, 2017
Applicant:

Palo Alto Research Center Incorporated, Palo Alto, CA (US);

Inventors:

Scott J. H. Limb, Palo Alto, CA (US);

Gregory L. Whiting, Menlo Park, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/15 (2006.01); H01L 25/065 (2006.01); H03K 19/177 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/573 (2013.01); H01L 21/486 (2013.01); H01L 21/4853 (2013.01); H01L 21/4864 (2013.01); H01L 23/15 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/49894 (2013.01); H01L 23/57 (2013.01); H01L 23/576 (2013.01); H01L 24/00 (2013.01); H01L 24/16 (2013.01); H01L 25/0655 (2013.01); H03K 19/17768 (2013.01); H01L 2224/16157 (2013.01); H01L 2224/16235 (2013.01); H01L 2924/15311 (2013.01);
Abstract

A transient electronic device utilizes a glass-based interposer that is treated using ion-exchange processing to increase its fragility, and includes a trigger device operably mounted on a surface thereof. An integrated circuit (IC) die is then bonded to the interposer, and the interposer is mounted to a package structure where it serves, under normal operating conditions, to operably connect the IC die to the package I/O pins/balls. During a transient event (e.g., when unauthorized tampering is detected), a trigger signal is transmitted to the trigger device, causing the trigger device to generate an initial fracture force that is applied onto the glass-based interposer substrate. The interposer is configured such that the initial fracture force propagates through the glass-based interposer substrate with sufficient energy to both entirely powderize the interposer, and to transfer to the IC die, whereby the IC die also powderizes (i.e., visually disappears).


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