The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2019
Filed:
Jul. 06, 2018
Fuji Electric Co., Ltd., Kanagawa, JP;
Kenichiro Sato, Nagano, JP;
FUJI ELECTRIC CO., LTD., Kanagawa, JP;
Abstract
A semiconductor device includes a heat dissipating unit that includes a primary part made of a first metal material and an embedded part that is embedded in a front surface of the primary part and that is made of a second metal material, a front surface of the heat dissipating unit having a mounting region on which a rear surface of a semiconductor element substrate is mounted so as to dissipate heat generated by the semiconductor element; and a sealing member that seals the semiconductor element, the substrate, and a sealed region of the front surface of the heat dissipating unit, wherein the embedded part is formed in the sealed region, and an absolute difference of the linear expansion coefficient of the second metal material and that of the sealing member is less than or equal to 25% of a value of the linear expansion coefficient of the sealing member.