The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2019

Filed:

May. 16, 2014
Applicants:

Jin Ho Kang, Newport News, VA (US);

Godfrey Sauti, Hampton, VA (US);

Cheol Park, Yorktown, VA (US);

Luke Gibbons, Williamsburg, VA (US);

Sheila Ann Thibeault, Hampton, VA (US);

Sharon E. Lowther, Hampton, VA (US);

Robert G. Bryant, Williamsburg, VA (US);

Inventors:

Jin Ho Kang, Newport News, VA (US);

Godfrey Sauti, Hampton, VA (US);

Cheol Park, Yorktown, VA (US);

Luke Gibbons, Williamsburg, VA (US);

Sheila Ann Thibeault, Hampton, VA (US);

Sharon E. Lowther, Hampton, VA (US);

Robert G. Bryant, Williamsburg, VA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 23/556 (2006.01); H01L 23/552 (2006.01); H01L 21/78 (2006.01); H01L 23/31 (2006.01); H01L 21/311 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/556 (2013.01); H01L 21/311 (2013.01); H01L 21/78 (2013.01); H01L 23/3107 (2013.01); H01L 23/552 (2013.01); H01L 23/3128 (2013.01); H01L 23/49562 (2013.01); H01L 24/73 (2013.01); H01L 2224/03831 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83192 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01);
Abstract

A novel radiation hardened chip package technology protects microelectronic chips and systems in aviation/space or terrestrial devices against high energy radiation. The proposed technology of a radiation hardened chip package using rare earth elements and mulitlayered structure provides protection against radiation bombardment from alpha and beta particles to neutrons and high energy electromagnetic radiation.


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