The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2019

Filed:

May. 15, 2018
Applicants:

National Technology & Engineering Solutions of Sandia, Llc, Albuquerque, NM (US);

Scott Silverman, San Marcos, CA (US);

Inventors:

David P. Adams, Albuquerque, NM (US);

Kira L. Fishgrab, Albuquerque, NM (US);

Karl Douglas Greth, Albuquerque, NM (US);

Michael David Henry, Albuquerque, NM (US);

Jeffrey Stevens, Albuquerque, NM (US);

V. Carter Hodges, Albuquerque, NM (US);

Randy J. Shul, Albuquerque, NM (US);

Ronald S. Goeke, Albuquerque, NM (US);

Robert K. Grubbs, Boise, ID (US);

Scott Silverman, San Marcos, CA (US);

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/538 (2006.01); H01L 23/48 (2006.01); H01L 25/065 (2006.01); H01L 23/31 (2006.01); H01L 23/14 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 21/4803 (2013.01); H01L 21/486 (2013.01); H01L 21/4853 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 23/5386 (2013.01); H01L 24/25 (2013.01); H01L 25/065 (2013.01); H01L 23/147 (2013.01); H01L 23/3121 (2013.01); H01L 23/49822 (2013.01); H01L 23/5384 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/13009 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/25105 (2013.01); H01L 2924/15311 (2013.01);
Abstract

The present invention relates to a lateral via to provide an electrical connection to a buried conductor. In one instance, the buried conductor is a through via that extends along a first dimension, and the lateral via extends along a second dimension that is generally orthogonal to the first dimension. In another instance, the second dimension is oblique to the first dimension. Components having such lateral vias, as well as methods for creating such lateral vias are described herein.


Find Patent Forward Citations

Loading…