The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2019
Filed:
Jul. 23, 2015
Renesas Electronics Corporation, Tokyo, JP;
Kazunori Hasegawa, Takasaki, JP;
Hiroi Oka, Takasaki, JP;
RENESAS ELECTRONICS CORPORATION, Tokyo, JP;
Abstract
Reliability of a semiconductor device is improved. For this, embodied is a basic idea that a semiconductor chip (CHP) mounted on an Ag layer (AGL) is fixed by using a temporarily fixing material (TA) having tackiness without forming the temporarily fixing material (TA) on a surface of the Ag layer (AGL) having a porous structure as much as possible, is realized. More specifically, the temporarily fixing material (TA) is supplied so as to have a portion made in contact with a chip mounting part (TAB), and the semiconductor chip (CHP) is also mounted on the Ag layer (AGL) so that one portion of a rear surface of the semiconductor chip (CHP) is made in contact with the temporarily fixing material (TA).