The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2019
Filed:
Mar. 27, 2018
Applicant:
Ablic Inc., Chiba-shi, Chiba, JP;
Inventor:
Kiyoaki Kadoi, Chiba, JP;
Assignee:
ABLIC INC., Chiba, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/49 (2006.01); H01L 23/00 (2006.01); H01L 23/482 (2006.01); H01L 23/055 (2006.01); H01L 23/495 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49 (2013.01); H01L 23/055 (2013.01); H01L 23/4822 (2013.01); H01L 23/49555 (2013.01); H01L 24/30 (2013.01); H01L 24/33 (2013.01); H05K 3/00 (2013.01); H01L 2224/4805 (2013.01); H01L 2224/48092 (2013.01);
Abstract
Provided is a semiconductor device enabling highly accurate adjustment of a mounting height at a time when the semiconductor device is mounted on an assembly board, and an electronic apparatus. A linear lead is extracted from a bottom surface of a cylindrical resin sealing body covering a semiconductor chip, and a plurality of helical leads are arranged so as to wind around the linear lead, to thereby form a multi-helical structure. The plurality of helical leads forming the multi-helical structure has the same pitch.