The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2019
Filed:
Dec. 30, 2015
Lappeenrannan Teknillinen Yliopisto, Lappeenranta, FI;
Mika Lohtander, Lappeenranta, FI;
Leevi Paajanen, Lappeenranta, FI;
Tapani Siivo, Lappeenranta, FI;
Antti Jortikka, Lappeenranta, FI;
Hannu Ylisiurua, Lappeenranta, FI;
Emma Paasonen, Lappeenranta, FI;
Jyrki Montonen, Lappeenranta, FI;
LAPPEENRANNAN TEKNILLINEN YLIOPISTO, Lappeenranta, FI;
Abstract
A semiconductor module includes a baseplate, a cover element attached to the baseplate so that detaching the cover element from the baseplate requires material deformations, and a semiconductor element in a room defined by the baseplate and the cover element. The semiconductor element is in a heat conductive relation with the baseplate and an outer surface of the baseplate is provided with laser machined grooves suitable for conducting heat transfer fluid. The laser machining makes it possible to make the grooves after the semiconductor module has been assembled. Therefore, regular commercially available semiconductor modules can be modified, with the laser machining, to semiconductor modules as disclosed.