The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2019
Filed:
Mar. 25, 2015
Applicant:
Kyocera Corporation, Kyoto-shi, Kyoto, JP;
Inventors:
Yuusaku Ishimine, Kyoto, JP;
Kenji Komatsubara, Kyoto, JP;
Assignee:
KYOCERA Corporation, Kyoto, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 25/07 (2006.01); C04B 35/584 (2006.01); H01L 23/473 (2006.01); B32B 18/00 (2006.01); H01L 23/00 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); B32B 18/00 (2013.01); C04B 35/584 (2013.01); H01L 23/3731 (2013.01); H01L 23/473 (2013.01); H01L 25/072 (2013.01); C04B 2235/3206 (2013.01); C04B 2235/3208 (2013.01); C04B 2235/3217 (2013.01); C04B 2235/3224 (2013.01); C04B 2235/3225 (2013.01); C04B 2235/3227 (2013.01); C04B 2235/3241 (2013.01); C04B 2235/3258 (2013.01); C04B 2235/3262 (2013.01); C04B 2235/3272 (2013.01); C04B 2235/3275 (2013.01); C04B 2235/5409 (2013.01); C04B 2235/80 (2013.01); C04B 2237/368 (2013.01); C04B 2237/582 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/13055 (2013.01); H05K 1/0209 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10106 (2013.01);
Abstract
A flow passage member includes a wall formed of ceramics, a space surrounded by the wall being a flow passage through which a fluid flows, a ratio of an area occupied by a grain boundary phase in an inner surface of a wall part of the wall in which wall part heat exchange is conducted being smaller than a ratio of an area occupied by a grain boundary phase in an outer surface of the wall part.