The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2019

Filed:

Jun. 23, 2017
Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Takeshi Kogure, Kyoto, JP;

Atsushi Ono, Kyoto, JP;

Hiroyuki Nagamori, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/50 (2006.01); H04B 1/00 (2006.01); H04B 1/50 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/50 (2013.01); H01L 23/3121 (2013.01); H01L 23/5389 (2013.01); H04B 1/00 (2013.01); H04B 1/006 (2013.01); H04B 1/50 (2013.01); H05K 1/0206 (2013.01); H01L 2224/48227 (2013.01);
Abstract

On a substrate (), a resistor (R) is disposed between a position of an amplifier circuit () and a position of a duplexer (), thereby reducing coupling occurring in a space between the amplifier circuit () and a path extending from a main switch () to a reception terminal (P) through the duplexer (). Even when an RX terminal () of the duplexer () is oriented toward an amplifier circuit () side, a high-frequency module () reduces the coupling and can thus prevent a harmonic of a transmission signal in a low band from leaking to the reception terminal (P) through a path formed by the coupling. That is, the high-frequency module () can prevent a reduction in isolation characteristics in the low band and a high band and also provide flexibility in substrate layout.


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