The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2019

Filed:

Sep. 26, 2016
Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventors:

Yoshinori Uezato, Kawasaki, JP;

Masayuki Soutome, Kawasaki, JP;

Rikihiro Maruyama, Kawasaki, JP;

Tomoaki Goto, Kawasaki, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/36 (2006.01); B23P 15/26 (2006.01); F28F 3/00 (2006.01); H01L 23/373 (2006.01); H01L 23/367 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4882 (2013.01); B23P 15/26 (2013.01); F28F 3/00 (2013.01); H01L 21/4803 (2013.01); H01L 21/4878 (2013.01); H01L 23/3675 (2013.01); H01L 23/3735 (2013.01); H01L 23/562 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); Y10T 29/49366 (2015.01);
Abstract

A semiconductor module radiator plate fabrication method includes soldering a plurality of insulating substrates of different shapes to a flat radiator plate, and forming a convex curve on an insulating substrate side of the radiator plate; obtaining a first concave curve by reversing the convex curve; setting a second concave curve on an insulating substrate side of a radiator plate after soldering, a bottom of the second concave curve being positioned under clearance between the plurality of insulating substrates; adding the first curve and the second curve to calculate a third concave curve on the insulating substrate side; and forming the third curve on a flat plate to form a radiator plate before soldering.


Find Patent Forward Citations

Loading…