The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2019

Filed:

Mar. 16, 2016
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Hong Seok Kim, Suwon-si, KR;

Chung Eun Lee, Suwon-si, KR;

Doo Young Kim, Suwon-si, KR;

Ki Han Kim, Suwon-si, KR;

Ji Ye Choi, Suwon-si, KR;

Kyung Ryul Lee, Suwon-si, KR;

Jae Yeol Choi, Suwon-si, KR;

Soo Kyong Jo, Suwon-si, KR;

Assignee:

Samsung Electro-Mechanics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/08 (2006.01); H01G 4/30 (2006.01); H01G 4/248 (2006.01); H01G 4/012 (2006.01);
U.S. Cl.
CPC ...
H01G 4/08 (2013.01); H01G 4/012 (2013.01); H01G 4/248 (2013.01); H01G 4/30 (2013.01);
Abstract

A multilayer ceramic electronic component includes a ceramic body in which dielectric layers and internal electrodes are alternately disposed. Ceramic-metal compound layers are disposed on interfaces between the internal electrodes and the dielectric layers. Additionally, in some examples, spaces between adjacent internal electrodes are fully occupied by the dielectric layers and the dielectric layers contain a ceramic-metal compound containing metal particle. The ceramic-metal compound layer may have an embossing type configuration or a dendrite type configuration.


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