The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2019
Filed:
Nov. 04, 2016
Applicant:
Epcos Ag, Munich, DE;
Inventors:
Uwe Wozniak, Deutschlandsberg, AT;
Thomas Feichtinger, Graz, AT;
Assignee:
EPCOS AG, München, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01C 7/10 (2006.01); H01C 7/112 (2006.01); H01C 1/148 (2006.01); H01C 7/108 (2006.01); H01C 7/18 (2006.01); H01C 17/065 (2006.01); H01C 17/28 (2006.01); C04B 35/453 (2006.01); C04B 37/02 (2006.01); H01C 17/00 (2006.01); B32B 18/00 (2006.01); H01C 7/102 (2006.01);
U.S. Cl.
CPC ...
H01C 7/112 (2013.01); B32B 18/00 (2013.01); C04B 35/453 (2013.01); C04B 37/021 (2013.01); C04B 37/023 (2013.01); H01C 1/148 (2013.01); H01C 7/1006 (2013.01); H01C 7/108 (2013.01); H01C 7/18 (2013.01); H01C 17/00 (2013.01); H01C 17/06533 (2013.01); H01C 17/283 (2013.01); C04B 2235/3217 (2013.01); C04B 2235/3241 (2013.01); C04B 2235/3265 (2013.01); C04B 2235/3277 (2013.01); C04B 2235/3279 (2013.01); C04B 2235/3284 (2013.01); C04B 2235/3291 (2013.01); C04B 2235/3294 (2013.01); C04B 2235/3298 (2013.01); C04B 2235/3409 (2013.01); C04B 2235/3418 (2013.01); C04B 2237/34 (2013.01); C04B 2237/408 (2013.01); C04B 2237/60 (2013.01); H01C 7/102 (2013.01);
Abstract
A multilayer component and a mathod for producing a multilayer component are disclosed. In an embodiment the multilayer component includes a ceramic main element being a varistor ceramic and at least one metal structure, wherein the metal structure is cosintered, and wherein the main element is doped with a material of the metal structure in such a way that a diffusion of the material from the metal structure into the main element during a sintering operation is reduced.