The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2019

Filed:

Aug. 28, 2014
Applicant:

Sunam Co., Ltd., Anseong-si, Gyeonggi-do, KR;

Inventors:

Kyu Han Choi, Hwaseong-si, KR;

Seung Hyun Moon, Seongnam-si, KR;

Soon Chul Hwang, Seoul, KR;

Hun Ju Lee, Yongin-si, KR;

Cheol Yeong Jang, Osan-si, KR;

Woong Kwon, Gimpo-si, KR;

Assignee:

Sunam Co., Ltd., Anseong-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 12/06 (2006.01); H01L 39/14 (2006.01); H01L 39/24 (2006.01); C23C 2/08 (2006.01); C23C 2/10 (2006.01); C23C 14/08 (2006.01); C23C 14/14 (2006.01); C23C 28/00 (2006.01);
U.S. Cl.
CPC ...
H01B 12/06 (2013.01); C23C 2/08 (2013.01); C23C 2/10 (2013.01); C23C 14/08 (2013.01); C23C 14/081 (2013.01); C23C 14/088 (2013.01); C23C 14/14 (2013.01); C23C 28/321 (2013.01); C23C 28/3455 (2013.01); H01L 39/143 (2013.01); H01L 39/247 (2013.01);
Abstract

The present invention relates to a superconductor and a method of manufacturing the same. The superconductor comprises: a substrate having a tape shape that extends in a first direction and having surfaces which are defined as a top surface, a bottom surface, and both side surfaces; a superconductive layer positioned on the top surface of the substrate; a first stabilizing layer disposed on the superconductive layer and containing a first metal; a protective layer disposed on the first stabilizing layer and containing a second metal which is different from the first metal; and an first alloy layer disposed between the stabilizing layer and the protective layer and containing the first and second metals.


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