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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10262245 B1

PDFFull Text
Date of Patent:
Apr. 16, 2019

Filed:

Dec. 14, 2015

Compact ejectable component assemblies in electronic devices

Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Jason Sloey, Cupertino, CA (US);

Michelle Yu, Oakland, CA (US);

Assignee:

APPLE INC., Cupertino, CA (US);

Attorney:

Morgan, Lewis & Bockius LLP

Primary Examiner:

Xanthia C Cunningham

Int. Cl.
CPC ...
H05K 5/02 (2006.01); H04B 1/3816 (2015.01); G06K 13/08 (2006.01); G06K 13/06 (2006.01); G06K 7/00 (2006.01); H05K 5/00 (2006.01);
U.S. Cl.
CPC ...
G06K 13/0831 (2013.01); G06K 7/003 (2013.01); G06K 13/06 (2013.01); H04B 1/3816 (2013.01); H05K 5/0091 (2013.01); H05K 5/0217 (2013.01); H05K 5/0247 (2013.01); H05K 5/0282 (2013.01); H05K 5/0286 (2013.01); H04M 2250/14 (2013.01); Y10T 29/49117 (2015.01); Y10T 29/49208 (2015.01); Y10T 29/49826 (2015.01);
Abstract

Electronic devices are provided with ejectable component assemblies. Each ejectable component assembly may include a tray that can be loaded with one or more types of removable module, such as a mini-SIM card and a micro-SIM card, and inserted into the device. Each assembly may also include a base coupled to a circuit board for electrically coupling with the removable module, a cage for biasing the module down against the base, and a guide for retaining the module at a functional insertion position within the device.

Find Patent Forward Citations

Sloey, Jason. (2019). Compact ejectable component assemblies in electronic devices (U.S. Patent No. 10262245). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10262245

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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