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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10261414 B1

PDFFull Text
Date of Patent:
Apr. 16, 2019

Filed:

Oct. 12, 2016

Liquid solder resist composition and printed wiring board

Applicant:

Goo Chemical Co., Ltd., Kyoto, JP;

Inventor:

Yoshio Sakai, Shiga, JP;

Assignee:

GOO CHEMICAL CO., LTD., Kyoto, JP;

Attorney:

Cheng Law Group, PLLC

Primary Examiner:

Cynthia Hamilton

Int. Cl.
CPC ...
H05K 3/28 (2006.01); H05K 3/34 (2006.01); G03F 7/004 (2006.01); G03F 7/027 (2006.01); G03F 7/031 (2006.01); G03F 7/038 (2006.01);
U.S. Cl.
CPC ...
G03F 7/038 (2013.01); G03F 7/004 (2013.01); G03F 7/027 (2013.01); G03F 7/031 (2013.01); H05K 3/28 (2013.01); H05K 3/287 (2013.01); H05K 3/3457 (2013.01);
Abstract

A liquid solder resist composition contains a carboxyl group-containing resin (A), a thermosetting component (B), a photopolymerizable component (C), a photopolymerization initiator (D), and a coloring agent (E). The thermosetting component (B) contains a powdery epoxy compound (B11) represented by following formula (1), An amount of the epoxy compound (B11) with respect to a total amount of the carboxyl group-containing resin (A), the thermosetting component (B), and the photopolymerizable component (C) is within a range of 15 to 40 weight %.

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Sakai, Yoshio. (2019). Liquid solder resist composition and printed wiring board (U.S. Patent No. 10261414). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10261414

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