The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2019
Filed:
Jan. 17, 2017
Applicant:
Ushio Denki Kabushiki Kaisha, Tokyo, JP;
Inventors:
Kinichi Morita, Tokyo, JP;
Toshikazu Kawaguchi, Sapporo, JP;
Assignee:
USHIO DENKI KABUSHIKI KAISHA, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01L 3/00 (2006.01); G01N 15/06 (2006.01); G01N 33/00 (2006.01); G01N 33/48 (2006.01); G01N 21/05 (2006.01); C01G 23/053 (2006.01); C03C 17/36 (2006.01);
U.S. Cl.
CPC ...
G01N 21/05 (2013.01); B01L 3/502707 (2013.01); C01G 23/053 (2013.01); C01G 23/0536 (2013.01); C03C 17/36 (2013.01); C03C 17/3607 (2013.01); C03C 17/3642 (2013.01); C03C 17/3649 (2013.01); C03C 17/3657 (2013.01); C03C 2217/70 (2013.01); C03C 2217/75 (2013.01); C03C 2218/111 (2013.01); C03C 2218/31 (2013.01); G01N 2021/056 (2013.01);
Abstract
Disclosed herein are a microchip provided with a titanium oxide film between a glass substrate and a metal thin film; and a method for forming the metal thin film and the titanium oxide film on the glass substrate of the microchip. The microchip has a second microchip substrate that has the metal thin film inside a channel, and the titanium oxide film, which has a low extinction coefficient, is provided as a buffer layer between the substrate and the metal thin film such as a gold film.