The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2019
Filed:
Feb. 25, 2016
Seiko Epson Corporation, Tokyo, JP;
Akira Ikeda, Chino, JP;
Sakiko Shimizu, Matsumoto, JP;
SEIKO EPSON CORPORATION, Tokyo, JP;
Abstract
A heat flow sensor includes a heat transfer layer that has first and second surfaces confronting each other and has flexibility and a temperature difference measurement unit that measures a temperature difference between the first and second surfaces of the heat transfer layer. The heat transfer layer includes a first member having flexibility and a second member with higher thermal conductivity than the first member. The thickness of the heat transfer layer is equal to or greater than 0.5 mm, thermal conductivity of the heat transfer layer is equal to or greater than 10 W/(m×K), and Shore hardness of the heat transfer layer is equal to or less than A50.