The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2019

Filed:

Jun. 24, 2016
Applicant:

Playnitride Inc., Tainan, TW;

Inventors:

Jun-Yu Lin, Tainan, TW;

Wen-Jie Lu, Tainan, TW;

Kuan-Yung Liao, Tainan, TW;

Sheng-Yuan Sun, Tainan, TW;

Assignee:

PlayNitride Inc., Tainan, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B60Q 1/06 (2006.01); F21V 29/60 (2015.01); F21V 29/503 (2015.01); F21V 29/507 (2015.01); F21V 29/83 (2015.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
F21V 29/60 (2015.01); F21V 29/503 (2015.01); F21V 29/507 (2015.01); F21V 29/83 (2015.01); F21Y 2115/10 (2016.08);
Abstract

A light emitting device includes a heat dissipation casing and an LED module. The heat dissipation casing includes an upper cover, a lower cover and a plurality of side covers. The upper cover has a plurality of first holes. The lower cover and the upper cover are opposite to each other. The side covers are connected to the upper cover and the lower cover, wherein there are at least two chamfered surfaces between the at least two side covers and the upper cover, and the chamfered surfaces have a plurality of second holes. The LED module is disposed inside the heat dissipation casing and located on the lower cover. The LED module has a light emitting surface, and the light emitting surface and the first and the second holes are respectively located on opposite sides of the LED module.


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