The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2019

Filed:

Oct. 23, 2017
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Hisaki Fujitani, Kyoto, JP;

Masumi Abe, Osaka, JP;

Kosuke Takehara, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F21K 9/64 (2016.01); H01L 25/075 (2006.01); F21K 9/00 (2016.01); F21V 5/00 (2018.01); F21V 7/00 (2006.01); F21Y 115/10 (2016.01); F21S 8/04 (2006.01); F21K 9/23 (2016.01); F21K 9/27 (2016.01); F21Y 103/10 (2016.01); F21V 5/04 (2006.01); F21V 13/02 (2006.01); F21K 9/69 (2016.01); F21K 9/68 (2016.01);
U.S. Cl.
CPC ...
F21K 9/64 (2016.08); F21K 9/00 (2013.01); F21V 5/00 (2013.01); F21V 7/0091 (2013.01); H01L 25/0753 (2013.01); F21K 9/23 (2016.08); F21K 9/27 (2016.08); F21K 9/68 (2016.08); F21K 9/69 (2016.08); F21S 8/04 (2013.01); F21V 5/04 (2013.01); F21V 13/02 (2013.01); F21Y 2103/10 (2016.08); F21Y 2115/10 (2016.08);
Abstract

A light-emitting module is provided. The light emitting module includes a substrate; a thin-film layer that is disposed above the substrate, the thin-film layer defining an opening that exposes a surface of the substrate; a light-emitting element disposed above the substrate and in the opening; and a sealant disposed above the substrate and in the opening, the sealant containing a wavelength converter and sealing the light-emitting element. A thickness of the thin-film layer is less than a thickness of the sealant. An edge portion of the sealant is in contact with the thin-film layer. The surface of the substrate and a surface of the thin-film layer are hydrophilic. The surface of the thin-film layer has a lower wettability than a wettability of the surface of the substrate.


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