The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2019
Filed:
Apr. 06, 2017
Applicant:
Omron Corporation, Kyoto-shi, Kyoto, JP;
Inventor:
Wakahiro Kawai, Konan, JP;
Assignee:
OMRON Corporation, Kyoto-shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 11/28 (2006.01); F16F 1/30 (2006.01); F16F 1/18 (2006.01); H01M 2/10 (2006.01); H01M 4/02 (2006.01); H01M 10/04 (2006.01);
U.S. Cl.
CPC ...
F16F 1/30 (2013.01); F16F 1/18 (2013.01); H01M 2/10 (2013.01); H01M 2/1038 (2013.01); H01M 4/02 (2013.01); H01M 10/0427 (2013.01); F16F 2226/00 (2013.01); H01M 2/1044 (2013.01); H01M 2004/027 (2013.01); H01M 2004/028 (2013.01); H01R 11/282 (2013.01);
Abstract
Provided is a plate spring fixing structure and the like which do not necessitate complex assembling processes and thus can reduce production cost and can be reduced in size, and which enable adjustment, during a production process, of the extent to which the plate spring is bent. A holding structure (A) includes a first plate spring () that has: a fixed portion () embedded in and fixed to a first molded resin part (); and a spring portion () which is not fixed and which has a spring property. The fixed portion () has a face that is not in contact with the first molded resin part ().