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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10259976 B1

PDFFull Text
Date of Patent:
Apr. 16, 2019

Filed:

Jan. 27, 2016

Paste-like adhesive composition, semiconductor device, method for manufacturing semiconductor device, and method for bonding heatsink

Applicant:

Sumitomo Bakelite Co., Ltd., Tokyo, JP;

Inventors:

Yasuo Shimobe, Tokyo, JP;

Ryuichi Murayama, Tokyo, JP;

Koji Makihara, Tokyo, JP;

Assignee:

Sumitomo Bakelite Co., Ltd., Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Mark Kopec

Assistant Examiner:

Jaison P Thomas

Int. Cl.
CPC ...
H01B 1/16 (2006.01); C09J 9/02 (2006.01); C09J 11/04 (2006.01); C09J 163/00 (2006.01); C09J 201/00 (2006.01); H01L 21/52 (2006.01); C09J 133/04 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
C09J 9/02 (2013.01); C09J 11/04 (2013.01); C09J 133/04 (2013.01); C09J 163/00 (2013.01); C09J 201/00 (2013.01); H01B 1/16 (2013.01); H01L 21/52 (2013.01); H01L 24/07 (2013.01); C09J 2203/326 (2013.01); C09J 2205/102 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01);
Abstract

A paste-like adhesive composition of the present invention contains metal particles (A) and a thermally polymerizable compound (B), in which the metal particles (A) form a particle coupling structure by causing sintering through a thermal treatment; when dynamic viscoelasticity of the composition is measured under a condition of a measurement frequency of 1 Hz, within a temperature region of 140° C. to 180° C., the composition has a temperature width of equal to or larger than 10° C. in which a shear modulus of elasticity is equal to or higher than 5,000 Pa and equal to or lower than 100,000 Pa; and an acetone insoluble fraction of a sample, which is obtained by removing the metal particles (A) and then heating the composition under conditions of 180° C. and 2 hours, is equal to or lower than 5% by weight.

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