The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2019

Filed:

Nov. 04, 2014
Applicant:

The Board of Trustees of the Leland Stanford Junior University, Stanford, CA (US);

Inventors:

Richard N. Zare, Stanford, CA (US);

Samuel Kim, Palo Alto, CA (US);

Raffick Amid Razzakk Bowen, Palo Alto, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C08J 7/12 (2006.01); B01L 3/00 (2006.01); A61L 29/06 (2006.01); A61L 29/14 (2006.01); A61B 5/15 (2006.01);
U.S. Cl.
CPC ...
C08J 7/12 (2013.01); A61B 5/150343 (2013.01); A61L 29/06 (2013.01); A61L 29/14 (2013.01); B01L 3/5082 (2013.01); A61L 2400/10 (2013.01); A61L 2400/18 (2013.01); B01L 2300/0832 (2013.01); B01L 2300/12 (2013.01); B01L 2300/16 (2013.01); C08J 2367/02 (2013.01); C08J 2369/00 (2013.01);
Abstract

Aspects of the invention include methods for modifying a surface of a non-porous hydrophobic polymer substrate having a backbone containing electrophilic linkages. In practicing methods according to certain embodiments, a liquid composition having a nucleophilic reagent and a catalyst is contacted with the surface of the non-porous hydrophobic polymer substrate and maintained in contact with the surface of the polymer substrate in a manner sufficient to convert at least a portion of the surface from hydrophobic to hydrophilic while retaining the mechanical and optical properties of the polymer substrate. Substrates, including containers, having one or more hydrophilic surfaces and kits suitable for practicing the subject methods are also described.


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