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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10259207 B1

PDFFull Text
Date of Patent:
Apr. 16, 2019

Filed:

Jan. 24, 2017

Method for forming separation starting point and separation method

Applicant:

Semiconductor Energy Laboratory Co., Ltd., Atsugi-shi, Kanagawa-ken, JP;

Inventors:

Masakatsu Ohno, Utsunomiya, JP;

Koichi Takeshima, Sano, JP;

Assignee:

Semiconductor Energy Laboratory Co., Ltd., Kanagawa-ken, JP;

Attorneys:

Robinson Intellectual Property Law Office

Eric J. Robinson

Primary Examiner:

Mark A Osele

Assistant Examiner:

Nickolas R Harm

Int. Cl.
CPC ...
B32B 43/00 (2006.01); H01L 21/683 (2006.01); H01L 27/12 (2006.01); H01L 51/00 (2006.01); B32B 37/18 (2006.01); H01L 51/56 (2006.01); B32B 38/10 (2006.01); B32B 37/02 (2006.01); B32B 37/12 (2006.01); B32B 37/00 (2006.01); H01L 27/32 (2006.01);
U.S. Cl.
CPC ...
B32B 43/006 (2013.01); H01L 21/6835 (2013.01); H01L 27/1266 (2013.01); H01L 51/003 (2013.01); B32B 37/02 (2013.01); B32B 37/025 (2013.01); B32B 37/1284 (2013.01); B32B 37/18 (2013.01); B32B 38/10 (2013.01); B32B 2310/0843 (2013.01); H01L 27/3244 (2013.01); H01L 51/0024 (2013.01); H01L 51/0097 (2013.01); H01L 51/56 (2013.01); H01L 2221/68381 (2013.01); H01L 2227/326 (2013.01); Y10T 156/1126 (2015.01); Y10T 156/1132 (2015.01); Y10T 156/1168 (2015.01); Y10T 156/1184 (2015.01); Y10T 156/1933 (2015.01); Y10T 156/1944 (2015.01); Y10T 156/1967 (2015.01);
Abstract

A starting point for separating a separation layer and a layer to be separated is formed in a process member. A first step of irradiating a first portion of the process member with first laser light in a frame-like shape and a second step of irradiating at least part of a region which is irradiated with the first laser light with second laser light are performed. The process member includes a first substrate, the separation layer, the layer to be separated, and an adhesive layer which are stacked in this order. In the first portion, the adhesive layer overlaps with the first substrate with the separation layer and the layer to be separated provided therebetween. In the first step, the first laser light is absorbed by at least the layer to be separated and the adhesive layer. In the second step, the second laser light is absorbed by at least the separation layer.

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