The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2019
Filed:
Jan. 30, 2015
Applicants:
Shenzhen Futaihong Precision Industry Co., Ltd., Shenzhen, CN;
Fih (Hong Kong) Limited, Kowloon, HK;
Inventors:
Assignees:
SHENZHEN FUTAIHONG PRECISION INDUSTRY CO, Shenzhen, CN;
FIH (HONG KONG) LIMITED, Kowloon, HK;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 3/26 (2006.01); B32B 15/04 (2006.01); B32B 27/06 (2006.01); B32B 27/28 (2006.01); B29C 45/00 (2006.01); B29C 45/14 (2006.01); B32B 27/36 (2006.01); B32B 27/30 (2006.01); B32B 15/08 (2006.01); B32B 15/09 (2006.01); B32B 15/18 (2006.01); B32B 15/20 (2006.01);
U.S. Cl.
CPC ...
B32B 3/26 (2013.01); B29C 45/00 (2013.01); B29C 45/14311 (2013.01); B32B 15/04 (2013.01); B32B 27/06 (2013.01); B32B 27/285 (2013.01); B29C 2045/14868 (2013.01); B32B 15/08 (2013.01); B32B 15/09 (2013.01); B32B 15/18 (2013.01); B32B 15/20 (2013.01); B32B 27/286 (2013.01); B32B 27/288 (2013.01); B32B 27/304 (2013.01); B32B 27/36 (2013.01); B32B 27/365 (2013.01); B32B 2250/02 (2013.01); B32B 2255/06 (2013.01); B32B 2255/20 (2013.01); B32B 2310/00 (2013.01); B32B 2311/18 (2013.01); B32B 2311/20 (2013.01); B32B 2311/24 (2013.01); B32B 2311/30 (2013.01); B32B 2327/06 (2013.01); B32B 2367/00 (2013.01); B32B 2369/00 (2013.01); B32B 2371/00 (2013.01); B32B 2509/00 (2013.01); B32B 2605/08 (2013.01); Y10T 428/24996 (2015.04);
Abstract
A metal-and-resin composite includes a metal substrate having a plurality of nano pores, an intermediate layer formed on the metal substrate, and a resin member. The intermediate layer fills at least portion of each nano pore. The resin member covers and bonds with the intermediate layer, thus to bond with the metal substrate.