The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2019

Filed:

Feb. 07, 2017
Applicant:

Board of Regents, the University of Texas System, Austin, TX (US);

Inventors:

Eric MacDonald, El Paso, TX (US);

David Espalin, El Paso, TX (US);

Ryan Wicker, El Paso, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B33Y 10/00 (2015.01); B23K 20/00 (2006.01); B29C 64/00 (2017.01); B23K 31/02 (2006.01); B23K 20/10 (2006.01); B33Y 40/00 (2015.01); B33Y 80/00 (2015.01); B33Y 70/00 (2015.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01); H05K 3/34 (2006.01); B29C 70/88 (2006.01); B29C 39/10 (2006.01); H05K 3/40 (2006.01); B29C 64/106 (2017.01); B29K 705/00 (2006.01); B23K 101/36 (2006.01);
U.S. Cl.
CPC ...
B23K 31/02 (2013.01); B23K 20/004 (2013.01); B23K 20/10 (2013.01); B29C 39/10 (2013.01); B29C 64/106 (2017.08); B29C 70/885 (2013.01); B33Y 10/00 (2014.12); B33Y 40/00 (2014.12); B33Y 70/00 (2014.12); B33Y 80/00 (2014.12); H05K 1/0284 (2013.01); H05K 3/34 (2013.01); H05K 3/4046 (2013.01); H05K 3/4644 (2013.01); H05K 3/4664 (2013.01); H05K 3/4697 (2013.01); B23K 2101/36 (2018.08); B29K 2705/00 (2013.01); H01L 2224/48091 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/10287 (2013.01); H05K 2203/0285 (2013.01); H05K 2203/049 (2013.01);
Abstract

A three-dimensional electronic, biological, chemical, thermal management, or electromechanical apparatus and method thereof. One or more layers of a three-dimensional structure are deposited on a substrate. The three-dimensional structure is configured to include one or more internal cavities using, an extrusion-based additive manufacturing system enhanced with a range of secondary embedding processes. The three-dimensional structure includes one or more structural integrated metal objects spanning the one or more of the internal cavities of the three-dimensional structure for enhanced electromagnetic properties and bonded between two or more other metal objects located at the same layer or different layers of the three-dimensional structure.


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