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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10257938 B1

PDFFull Text
Date of Patent:
Apr. 09, 2019

Filed:

Jul. 24, 2014

Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board

Applicant:

Jx Nippon Mining & Metals Corporation, Tokyo, JP;

Inventor:

Michiya Kohiki, Ibaraki, JP;

Assignee:

JX Nippon Mining & Metals Corporation, Tokyo, JP;

Attorney:

Drinker Biddle & Reath LLP

Primary Examiner:

David Sample

Assistant Examiner:

Donald M Flores, Jr

Int. Cl.
CPC ...
H05K 3/02 (2006.01); H05K 3/38 (2006.01); H05K 3/20 (2006.01); B32B 15/08 (2006.01); C25D 7/06 (2006.01); C23C 18/16 (2006.01); B32B 15/20 (2006.01); B32B 27/20 (2006.01); C25D 5/10 (2006.01); H05K 1/09 (2006.01); C25D 1/04 (2006.01); C25D 3/38 (2006.01); C25D 3/58 (2006.01);
U.S. Cl.
CPC ...
H05K 3/025 (2013.01); B32B 15/08 (2013.01); B32B 15/20 (2013.01); B32B 27/20 (2013.01); C23C 18/1653 (2013.01); C25D 5/10 (2013.01); C25D 7/0614 (2013.01); H05K 3/205 (2013.01); H05K 3/384 (2013.01); H05K 3/389 (2013.01); B32B 2457/08 (2013.01); C25D 1/04 (2013.01); C25D 3/38 (2013.01); C25D 3/58 (2013.01); C25D 7/0671 (2013.01); H05K 1/09 (2013.01); H05K 3/388 (2013.01); H05K 2201/0355 (2013.01); H05K 2203/0307 (2013.01); H05K 2203/072 (2013.01); H05K 2203/0726 (2013.01);
Abstract

The present invention provides a surface-treated copper foil capable of imparting the profile shape of the substrate surface after removal of the copper foil, the profile shape maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The present invention also provides a resin substrate provided with a profile shape of the surface maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The surface-treated copper foil of the present invention is a surface-treated copper foil, wherein a surface-treated layer is formed on a copper foil, and the proportion of the area corresponding to the particles of the surface of the surface-treated layer is 0.1 to 0.85.

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