The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2019

Filed:

Sep. 26, 2016
Applicant:

Rohm Co., Ltd., Kyoto-shi, Kyoto, JP;

Inventor:

Kentaro Naka, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01C 1/01 (2006.01); H05K 1/18 (2006.01); H01C 17/00 (2006.01); H01C 17/28 (2006.01); H01C 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H01C 1/01 (2013.01); H01C 1/14 (2013.01); H01C 17/006 (2013.01); H01C 17/28 (2013.01); H01C 17/281 (2013.01); H05K 2201/10022 (2013.01); Y10T 29/49082 (2015.01);
Abstract

[Object] A method for efficiently manufacturing chip resistors is provided. [Means] The method includes the steps of preparing at least three conductive elongated boardsmade of an electrically conductive material and a resistive membermade of a resistive material, arranging the at least three conductive elongated boardsapart from each other along a width direction crossing a longitudinal direction in which one of the at least three conductive elongated boardsis elongated, forming a resistor aggregateby bonding the resistive memberto the at least three conductive elongated boards, and collectively dividing the resistor aggregateinto a plurality of chip resistors by punching so that each of the chip resistors includes two electrodes and a resistor portion bonded to the two electrodes.


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