The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2019
Filed:
Feb. 16, 2016
Applicant:
Microsoft Technology Licensing, Llc., Redmond, WA (US);
Inventors:
David Mandelboum, Rakefet, IL;
Shlomo Felzenshtein, Nesher, IL;
Boaz Shem-Tov, Raanana, IL;
Raymond Kirk Price, Redmond, WA (US);
Ravi Kiran Nalla, San Jose, CA (US);
Assignee:
Microsoft Technology Licensing, LLC., Redmond, WA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 3/32 (2006.01); G03B 15/03 (2006.01); F21V 19/00 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01); F21Y 115/30 (2016.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); F21V 19/0015 (2013.01); G03B 15/03 (2013.01); H05K 1/0206 (2013.01); H05K 1/0207 (2013.01); H05K 1/0298 (2013.01); H05K 1/181 (2013.01); H05K 3/0061 (2013.01); H05K 3/321 (2013.01); H05K 3/4602 (2013.01); H05K 3/4608 (2013.01); H05K 3/4617 (2013.01); H05K 3/4644 (2013.01); H05K 3/4652 (2013.01); F21Y 2115/30 (2016.08); H05K 2201/09536 (2013.01); H05K 2201/10121 (2013.01); H05K 2203/049 (2013.01);
Abstract
A light source module comprising a semiconductor light source mounted directly to a conducting trace of a multilayer printed circuit board having a core comprising a plurality of core layers electrically and thermally coupled by a plurality of buried vias wherein at least one of the core layers comprises a heat sink plane.