The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2019
Filed:
Aug. 23, 2018
Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;
Toshiro Adachi, Nagaokakyo, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
A resin substrate includes a first portion including a plurality of resin sheets provided at one end in a stacking direction and a second portion including a plurality of resin sheets provided at the other end in the stacking direction. The thickness of the plurality of resin sheets is the same or substantially the same as the thickness of the first portion and the second portion. The density of planar conductor patterns of the first portion with respect to the volume of the first portion is lower than the density of planar conductor patterns of the second portion with respect to the volume of the second portion. The average of the diameters of the first interlayer connection conductor provided in the first portion is greater than the average of the diameters of the second interlayer connection conductor provided in the second portion.