The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2019

Filed:

Apr. 19, 2016
Applicant:

Invensense, Inc., San Jose, CA (US);

Inventors:

David Bolognia, North Andover, MA (US);

Kieran Harney, Andover, MA (US);

Assignee:

INVENSENSE, INC., San Jose, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H04R 31/00 (2006.01); H04R 1/28 (2006.01); H04R 1/04 (2006.01); H04R 1/08 (2006.01); H04R 1/22 (2006.01); H04R 19/00 (2006.01); H04R 19/04 (2006.01);
U.S. Cl.
CPC ...
H04R 1/2892 (2013.01); H04R 1/04 (2013.01); H04R 1/08 (2013.01); H04R 1/222 (2013.01); H04R 19/005 (2013.01); H04R 19/04 (2013.01); H04R 31/006 (2013.01); H04R 2201/003 (2013.01); H04R 2201/029 (2013.01); H04R 2410/03 (2013.01);
Abstract

A packaged microphone has a lid structure with an inner surface having a concavity, and a microphone die secured within the concavity. The packaged microphone also has a substrate coupled with the lid structure to form a package having an interior volume containing the microphone die. The substrate is electrically connected with the microphone die. In addition, the packaged microphone also has aperture formed through the package, and a seal proximate to the microphone die. The seal acoustically seals the microphone and the aperture to form a front volume and a back volume within the interior volume. The aperture is in acoustic communication with the front volume.


Find Patent Forward Citations

Loading…