The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2019

Filed:

Dec. 01, 2015
Applicant:

Juniper Networks, Inc., Sunnyvale, CA (US);

Inventors:

Theodore John Schmidt, Gilroy, CA (US);

Roberto Marcoccia, San Jose, CA (US);

Assignee:

Juniper Networks, Inc., Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 10/40 (2013.01); H04J 14/02 (2006.01); H04B 10/073 (2013.01);
U.S. Cl.
CPC ...
H04J 14/0221 (2013.01); H04B 10/0731 (2013.01);
Abstract

An article may include an optical transceiver package, which may include a photonics component mounted in the optical transceiver package. The photonics component may generate heat in an operational state. The optical transceiver package may include a sealed thermal chamber that maintains the photonics component between a lower predetermined working temperature and a higher predetermined working temperature. The sealed thermal chamber may include a material that exhibits a first thermal conductivity below a lower predetermined threshold temperature and a second thermal conductivity higher than the first thermal conductivity above an upper predetermined threshold temperature. A method may include retaining the generated heat to raise the photonics component above a lower predetermined working temperature, and conducting the generated heat away from the optical transceiver package to lower the photonics component below an upper predetermined working temperature. A system may include the optical transceiver package mounted to a printed circuit board.


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