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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10256618 B1

PDFFull Text
Date of Patent:
Apr. 09, 2019

Filed:

Mar. 01, 2017

Conductive surfacing material for composite structures

Applicant:

Cytec Industries Inc., Woodland Park, NJ (US);

Inventors:

Junjie Jeffrey Sang, Newark, DE (US);

Dalip Kumar Kohli, Churchville, MD (US);

Assignee:

CYTEC INDUSTRIES INC., Woodland Park, NJ (US);

Attorney:

Thi Dang

Primary Examiner:

John L Goff, II

Int. Cl.
CPC ...
H02G 13/00 (2006.01); H05K 9/00 (2006.01); C08J 5/24 (2006.01); B32B 5/02 (2006.01); B32B 5/12 (2006.01); B32B 5/26 (2006.01); B32B 15/14 (2006.01); B32B 15/20 (2006.01); C08G 59/38 (2006.01); C08L 63/00 (2006.01); B32B 37/14 (2006.01); C09D 163/00 (2006.01);
U.S. Cl.
CPC ...
H02G 13/80 (2013.01); B32B 5/022 (2013.01); B32B 5/12 (2013.01); B32B 5/26 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); B32B 37/14 (2013.01); C08G 59/38 (2013.01); C08J 5/24 (2013.01); C08L 63/00 (2013.01); H05K 9/0084 (2013.01); B32B 2260/021 (2013.01); B32B 2260/023 (2013.01); B32B 2260/046 (2013.01); B32B 2264/105 (2013.01); B32B 2264/107 (2013.01); B32B 2264/108 (2013.01); B32B 2305/076 (2013.01); B32B 2307/202 (2013.01); B32B 2307/536 (2013.01); B32B 2605/08 (2013.01); B32B 2605/12 (2013.01); B32B 2605/18 (2013.01); C08L 2205/02 (2013.01); C09D 163/00 (2013.01); Y10T 156/1002 (2015.01); Y10T 428/249974 (2015.04); Y10T 428/252 (2015.01);
Abstract

An electrically conductive surfacing material capable of providing sufficient conductivity for lightning strike protection (LSP) and/or electromagnetic interference (EMI) shielding is disclosed. The conductive surfacing material is a multi-layered structure having a very thin conductive layer (e.g. solid metal foil) and a resin film formed on at least one surface of the conductive layer. The resin film is formed from a curable resin composition containing an epoxy novolac resin, a tri-functional or tetra-functional epoxy resin, ceramic microspheres, a latent amine-based curing agent, particulate inorganic fillers; and a toughening component. Optionally, the resin film further includes conductive additives to increase electrical conductivity of the surfacing material. The resin film exhibits high Tas well as high resistance to paint stripper solutions. Furthermore, the conductive surfacing material is suitable for co-curing with fiber-reinforced resin composite substrates.

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