The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2019

Filed:

Jun. 27, 2016
Applicant:

The George Washington University, Washington, DC (US);

Inventors:

Shuai Sun, Vienna, VA (US);

Volker J. Sorger, Alexandria, VA (US);

Tarek El-Ghazawi, Vienna, VA (US);

Vikram K. Narayana, Ashburn, VA (US);

Abdel-Hameed A. Badawy, Little Rock, AR (US);

Assignee:

The George Washington University, Washington, DC (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01S 5/00 (2006.01); H01S 5/10 (2006.01); H01S 5/042 (2006.01); G02B 6/12 (2006.01);
U.S. Cl.
CPC ...
H01S 5/0014 (2013.01); G02B 6/12004 (2013.01); H01S 5/0427 (2013.01); H01S 5/1046 (2013.01); G02B 2006/12121 (2013.01); G02B 2006/12123 (2013.01);
Abstract

The Hybrid Photonic Plasmonic Interconnect (HyPPI) combines both low loss photonic signal propagation and passive routing with ultra-compact plasmonic devices. These optical interconnects therefore uniquely combine fast operational data-bandwidths (in hundreds of Gbps) for light manipulation with low optical attenuation losses by hybridizing low loss photonics with strong light-matter-interaction plasmonics to create, modulate, switch and detect light efficiently at the same time. Initial implementations were considered for on-chip photonic integration, but also promising for free space or fiber-based systems. In general two technical options exist, which distinguished by the method the electric-optic conversion is executed: the extrinsic modulation method consists of an continuous wave source such as an LED or laser operating at steady power output, and signal encoding is done via an electro-optic modulator downstream of the source in the interconnect. In contrast, in the intrinsic method, the optical source is directly amplitude modulated.


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