The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2019

Filed:

Jul. 07, 2016
Applicant:

Magnachip Semiconductor, Ltd., Cheongju-si, KR;

Inventors:

Kwan Soo Kim, Cheongju-si, KR;

Dong Joon Kim, Cheongju-si, KR;

Seung Han Ryu, Cheongju-si, KR;

Hee Baeg An, Cheongju-si, KR;

Jong Yeul Jeong, Cheongju-si, KR;

Kyung Soo Kim, Cheongju-si, KR;

Kang Sup Shin, Cheongju-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 43/04 (2006.01); H01L 43/06 (2006.01); H01L 43/14 (2006.01); G01R 33/00 (2006.01); G01R 33/07 (2006.01);
U.S. Cl.
CPC ...
H01L 43/04 (2013.01); G01R 33/0011 (2013.01); G01R 33/0052 (2013.01); G01R 33/07 (2013.01); H01L 43/065 (2013.01); H01L 43/14 (2013.01);
Abstract

Provided are a magnetic sensor and a method of fabricating the same. The magnetic sensor includes: hall elements disposed in a substrate, a protection layer disposed on the substrate, a seed layer disposed on the protection layer, and an integrated magnetic concentrator (IMC) formed on the seed layer, the seed layer and the IMC each having an uneven surface.


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