The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2019

Filed:

Feb. 10, 2015
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Hiroshi Saito, Kawasaki, JP;

Shunsuke Murakami, Sheffield, GB;

Jumpei Hayashi, Yokohama, JP;

Kanako Oshima, Tokyo, JP;

Hidenori Tanaka, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B06B 1/06 (2006.01); B41J 2/14 (2006.01); H02N 2/00 (2006.01); H02N 2/10 (2006.01); H02N 2/16 (2006.01); H04N 1/00 (2006.01); C04B 35/49 (2006.01); G02B 27/00 (2006.01); H01L 41/09 (2006.01); H01L 41/18 (2006.01); H04N 5/225 (2006.01); C04B 35/468 (2006.01); H01L 41/047 (2006.01); H01L 41/083 (2006.01); H01L 41/187 (2006.01);
U.S. Cl.
CPC ...
H01L 41/1871 (2013.01); B06B 1/06 (2013.01); B41J 2/14201 (2013.01); C04B 35/4682 (2013.01); C04B 35/49 (2013.01); G02B 27/0006 (2013.01); H01L 41/0471 (2013.01); H01L 41/0477 (2013.01); H01L 41/083 (2013.01); H01L 41/0973 (2013.01); H01L 41/18 (2013.01); H02N 2/001 (2013.01); H02N 2/106 (2013.01); H02N 2/163 (2013.01); C04B 2235/3203 (2013.01); C04B 2235/3206 (2013.01); C04B 2235/3208 (2013.01); C04B 2235/3215 (2013.01); C04B 2235/3236 (2013.01); C04B 2235/3244 (2013.01); C04B 2235/3248 (2013.01); C04B 2235/3262 (2013.01); C04B 2235/3281 (2013.01); C04B 2235/3298 (2013.01); C04B 2235/3409 (2013.01); C04B 2235/3418 (2013.01); C04B 2235/5445 (2013.01); C04B 2235/77 (2013.01); C04B 2235/785 (2013.01); C04B 2235/786 (2013.01); C04B 2235/79 (2013.01); H04N 1/00909 (2013.01); H04N 5/2253 (2013.01);
Abstract

There is provided a lead-free piezoelectric material having a satisfactory piezoelectric constant and mechanical quality factor in the range of device operating temperatures (from −30° C. to 50° C.). The piezoelectric material contains a main constituent containing a perovskite-type metal oxide expressed by the general formula (BaCa)(TiZr)O, where x, y and a satisfy the 0.030≤x<0.090, 0.030≤y≤0.080, and 0.9860≤a≤1.0200. The material also contains 0.040 to 0.500 part by weight of Mn, 0.042 to 0.850 part by weight of Bi, 0 to 0.028 part by weight of Li, 0.001 to 4.000 part by weight of a third sub-constituent including at least one of Si and B, and 0.001 to 4.000 parts by weight of Cu, each in terms of element relative to 100 parts by weight of the metal oxide.


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