The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2019
Filed:
Nov. 05, 2015
Applicant:
Osram Opto Semiconductors Gmbh, Regensburg, DE;
Inventors:
Wolfgang Moench, Pentling, DE;
Frank Singer, Regenstauf, DE;
Thomas Schwarz, Regensburg, DE;
Jürgen Moosburger, Lappersdorf, DE;
Stefan Illek, Donaustauf, DE;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/58 (2010.01); H01L 33/00 (2010.01); H01L 33/56 (2010.01); H01L 33/50 (2010.01); H01L 33/62 (2010.01); H02N 1/00 (2006.01);
U.S. Cl.
CPC ...
H01L 33/58 (2013.01); H01L 33/0095 (2013.01); H01L 33/505 (2013.01); H01L 33/56 (2013.01); H01L 33/62 (2013.01); H02N 1/006 (2013.01); H01L 2933/0058 (2013.01);
Abstract
A method of producing an optoelectronic component includes embedding an optoelectronic component part into a molded body such that an upper side of the optoelectronic component part is at least partially exposed on an upper side of the molded body; arranging and structuring a sacrificial layer above the upper side of the optoelectronic component part and the upper side of the molded body; arranging and structuring a layer of an optical material above the sacrificial layer; and removing the sacrificial layer.