The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2019

Filed:

Dec. 29, 2017
Applicant:

Lg Electronics Inc., Seoul, KR;

Inventors:

Youngsung Yang, Seoul, KR;

Hyungjin Kwon, Seoul, KR;

Chungyi Kim, Seoul, KR;

Junghoon Choi, Seoul, KR;

Assignee:

LG ELECTRONICS INC., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 31/18 (2006.01); H01L 31/0216 (2014.01); H01L 31/068 (2012.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 31/1868 (2013.01); H01L 21/02131 (2013.01); H01L 21/02238 (2013.01); H01L 21/02255 (2013.01); H01L 21/02337 (2013.01); H01L 31/02167 (2013.01); H01L 31/0682 (2013.01); H01L 31/1864 (2013.01); Y02E 10/547 (2013.01);
Abstract

A method of manufacturing a solar cell, the method includes forming a protective film over a semiconductor substrate, the semiconductor substrate including a base area of a first conductive type and formed of crystalline silicon, wherein the forming of the protective film includes a heat treatment process performed at a heat treatment temperature of approximately 600 degrees Celsius or more under a gas atmosphere including nitrogen, and wherein the heat treatment process includes: a main section, during which the heat treatment temperature is maintained, a temperature increase section before the main section, during which an increase in temperature occurs from an introduction temperature to the heat treatment temperature, and a temperature reduction section after the main section, during which a decrease in temperature occurs from the heat treatment temperature to a discharge temperature.


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