The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2019

Filed:

May. 27, 2016
Applicant:

Denso Corporation, Kariya, Aichi-pref., JP;

Inventors:

Kenji Kouno, Kariya, JP;

Hiromitsu Tanabe, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H01L 23/367 (2006.01); H01L 23/00 (2006.01); H01L 27/06 (2006.01); H01L 29/06 (2006.01); H01L 29/739 (2006.01); H02M 7/00 (2006.01); H01L 29/08 (2006.01); H01L 29/10 (2006.01); H02M 7/5387 (2007.01); H02P 27/06 (2006.01); H02M 1/32 (2007.01);
U.S. Cl.
CPC ...
H01L 25/0655 (2013.01); H01L 23/367 (2013.01); H01L 24/06 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); H01L 27/0635 (2013.01); H01L 29/0696 (2013.01); H01L 29/7397 (2013.01); H02M 7/003 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 29/0804 (2013.01); H01L 29/0821 (2013.01); H01L 29/1004 (2013.01); H01L 29/1095 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/73215 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/12036 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/14252 (2013.01); H01L 2924/181 (2013.01); H02M 7/5387 (2013.01); H02M 2001/327 (2013.01); H02P 27/06 (2013.01);
Abstract

The present disclosure provides a semiconductor chip. The semiconductor chip includes a switching element having a gate electrode, a first pad, and a second pad. The first control pad is electrically connected to the gate electrode and applied with a voltage controlling the switching element to switch on or switch off. The second control pad provides a current path of a control current flowing between the first control pad and the second control pad when the switching element is in a switch-on state. One of the first control pad or the second control pad includes two pad components and a remaining one of the first control pad or the second control pad is disposed between the two pad components of the one of the first control pad or the second control pad.


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