logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10256209 B1

PDFFull Text
Date of Patent:
Apr. 09, 2019

Filed:

Mar. 19, 2018

Resin substrate, component-mounted resin substrate, method of manufacturing resin substrate, and method of manufacturing component-mounted resin substrate

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Keisuke Ikeno, Nagaokakyo, JP;

Kuniaki Yosui, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Kyoto, JP;

Attorney:

Keating & Bennett, LLP

Primary Examiner:

S V Clark

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H05K 1/11 (2006.01); H05K 3/32 (2006.01); H01L 23/14 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); H01L 21/481 (2013.01); H01L 21/4853 (2013.01); H01L 23/4985 (2013.01); H01L 23/49811 (2013.01); H01L 23/49838 (2013.01); H01L 23/49894 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H05K 1/111 (2013.01); H05K 3/328 (2013.01); H01L 21/563 (2013.01); H01L 23/145 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81205 (2013.01); H01L 2224/9211 (2013.01); H05K 2201/099 (2013.01); H05K 2201/10674 (2013.01); H05K 2203/0285 (2013.01);
Abstract

A component-mounted resin substrate includes a thermoplastic resin substrate and an electronic component. The resin substrate includes a surface including a mounting land conductor and a reinforcing resin member. A bump of the electronic component is joined to the mounting land conductor by ultrasonic joining. The reinforcing resin member is in contact with a side surface of the mounting land conductor and has a height smaller than a height of the mounting land conductor.

Find Patent Forward Citations

Quick Actions:

Ikeno, Keisuke. (2019). Resin substrate, component-mounted resin substrate, method of manufacturing resin substrate, and method of manufacturing component-mounted resin substrate (U.S. Patent No. 10256209). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10256209

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…