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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10256195 B1

PDFFull Text
Date of Patent:
Apr. 09, 2019

Filed:

Dec. 19, 2017

Module and method for manufacturing same

Applicant:

Murata Manufacturing Co., Ltd, Kyoto, JP;

Inventors:

Issei Yamamoto, Kyoto, JP;

Atsushi Shimizu, Kyoto, JP;

Yoichi Takagi, Kyoto, JP;

Hideo Nakagoshi, Kyoto, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Kyoto, JP;

Attorney:

Pearne & Gordon LLP

Primary Examiner:

Mohammed R Alam

Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/00 (2006.01); H01L 23/28 (2006.01); H05K 9/00 (2006.01); C23C 14/00 (2006.01); C23C 14/06 (2006.01); C23C 14/14 (2006.01); C23C 14/24 (2006.01); H01L 21/285 (2006.01); H01L 21/3205 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); C23C 14/0036 (2013.01); C23C 14/0641 (2013.01); C23C 14/14 (2013.01); C23C 14/24 (2013.01); H01L 21/2855 (2013.01); H01L 21/32051 (2013.01); H01L 23/00 (2013.01); H01L 23/28 (2013.01); H01L 23/3135 (2013.01); H01L 23/3142 (2013.01); H01L 23/49838 (2013.01); H05K 9/00 (2013.01); H01L 23/3121 (2013.01); H01L 25/165 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19105 (2013.01);
Abstract

A module includes a wiring board, a plurality of components mounted on an upper surface of the wiring board, a sealing resin layer which seals the components provided on the upper surface of the wiring board, and a shield layer provided so as to cover a surface of the sealing resin layer. The shield layer includes an adhesion layer which is stacked on the surface of the sealing resin layer and includes a first adhesion film composed of a metal selected from the group consisting of Ti, Cr, Ni, TiCr, TiAl, NiAl, CrAl, and CrNiAl, a conductive layer which is stacked on the adhesion layer, and a protective layer which is stacked on the conductive layer and includes a protective film composed of a nitride, oxide, or oxynitride of a metal selected from the group consisting of Ti, Cr, Ni, TiCr, TiAl, NiAl, CrAl, and CrNiAl.

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