The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2019
Filed:
Dec. 21, 2015
Applicant:
Denso Corporation, Kariya, Aichi-pref., JP;
Inventors:
Tetsuya Sueyoshi, Kariya, JP;
Hiroaki Ando, Kariya, JP;
Assignee:
DENSO CORPORATION, Kariya, Aichi-pref., JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/467 (2006.01);
U.S. Cl.
CPC ...
H01L 23/467 (2013.01); H05K 7/20145 (2013.01); H05K 7/20863 (2013.01); H05K 7/20972 (2013.01); H01L 2924/0002 (2013.01);
Abstract
An electronic device for a vehicle includes a substrate and a semiconductor package. The substrate is arranged to extend along a flowing path of wind produced by a fan unit. The semiconductor package is disposed on the substrate to be cooled by the wind. When an inflow port from which the wind is drawn by the fan unit is defined to include a flowing path having a first cross-section area, the semiconductor package is disposed in a space including a flowing path having a cross-section area that is larger than the first cross-section area.