The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2019
Filed:
Feb. 28, 2017
Applicant:
Fuji Electric Co., Ltd., Kawasaki-shi, Kanagawa, JP;
Inventors:
Naoyuki Kanai, Kawasaki, JP;
Tatsuhiko Asai, Kawasaki, JP;
Assignee:
Fuji Electric Co., Ltd., , JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); H01L 21/48 (2006.01); H01L 21/52 (2006.01); H01L 21/56 (2006.01); H01L 23/053 (2006.01); H01L 23/08 (2006.01); H01L 23/18 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); H01L 21/4803 (2013.01); H01L 21/52 (2013.01); H01L 21/565 (2013.01); H01L 23/053 (2013.01); H01L 23/08 (2013.01); H01L 23/18 (2013.01); H01L 23/295 (2013.01); H01L 23/3121 (2013.01); H01L 24/32 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 24/85 (2013.01); H01L 24/92 (2013.01); H01L 2224/2912 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/29155 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/014 (2013.01); H01L 2924/067 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/0705 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/1579 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/186 (2013.01);
Abstract
A highly-reliable semiconductor device has improved adhesion between a sealing material and a sealed metal member and/or a case member. In some implementations, the semiconductor device includes: a laminated substrate on which a semiconductor element is mounted; and a sealing material. In some implementations, the sealing material contains an epoxy base resin, a curing agent, and a phosphonic acid.