The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2019

Filed:

May. 07, 2018
Applicant:

Cyntec Co., Ltd., Hsinchu, TW;

Inventors:

Chia Pei Chou, Hsinchu, TW;

Lang-Yi Chiang, Hsinchu County, TW;

Jih-Hsu Yeh, Taipei, TW;

You Chang Tseng, Hsinchu, TW;

Assignee:

CYNTEC CO., LTD., Hsinchu, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 21/486 (2013.01); H01L 23/495 (2013.01); H01L 23/49811 (2013.01); H01L 23/4952 (2013.01); H01L 23/49827 (2013.01); H01L 2924/00 (2013.01); H01L 2924/0002 (2013.01); Y10T 29/49117 (2015.01);
Abstract

A method to form an electrical component, the method comprising: providing a first lead and a second lead; forming a first conductive pillar and a second conductive pillar on a first portion of the top surface of the first lead and a first portion of the top surface of the second lead, respectively, wherein a second portion of the top surface of the first lead, a second portion of the top surface of the second lead, the first conductive pillar, and the second conductive pillar form a 3D space, wherein at least one device is disposed in said 3D space and electrically connected to the at least one device to the first conductive pillar and the second conductive pillar.


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