The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2019

Filed:

Dec. 15, 2015
Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventors:

Tomohiro Hirai, Ibaraki, JP;

Hiroshi Kawaguchi, Ibaraki, JP;

Assignee:

Renesas Electronics Corporation, Koutou-ku, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/28 (2006.01); H01L 21/306 (2006.01); H01L 21/324 (2006.01); H01L 21/768 (2006.01); H01L 23/535 (2006.01); H01L 29/201 (2006.01); H01L 29/423 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 29/40 (2006.01); H01L 29/778 (2006.01); H01L 21/30 (2006.01); H01L 29/417 (2006.01); H01L 29/20 (2006.01);
U.S. Cl.
CPC ...
H01L 21/28114 (2013.01); H01L 21/3006 (2013.01); H01L 21/30604 (2013.01); H01L 21/324 (2013.01); H01L 21/3245 (2013.01); H01L 21/76897 (2013.01); H01L 23/535 (2013.01); H01L 29/201 (2013.01); H01L 29/402 (2013.01); H01L 29/4238 (2013.01); H01L 29/66446 (2013.01); H01L 29/66462 (2013.01); H01L 29/7786 (2013.01); H01L 29/78 (2013.01); H01L 29/2003 (2013.01); H01L 29/41758 (2013.01); H01L 29/4236 (2013.01);
Abstract

The present invention makes it possible to improve the characteristic of a semiconductor device using a nitride semiconductor. An electrically-conductive film is formed above a gate electrode above a substrate with an interlayer insulation film interposed and a source electrode coupled to a barrier layer on one side of the gate electrode and a drain electrode coupled to the barrier layer on the other side of the gate electrode are formed by etching the electrically-conductive film. On this occasion, the source electrode is etched so as to have a shape extending beyond above the gate electrode to the side of the drain electrode and having a gap (opening) above the gate electrode. Successively, hydrogen annealing is applied to the substrate. In this way, by forming the gap at a source field plate section of the source electrode, it is possible to efficiently supply hydrogen in the region where a channel is formed in the hydrogen annealing process.


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