The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2019

Filed:

Dec. 30, 2015
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Shi Wei Toh, Mountain View, CA (US);

Avgerinos V. Gelatos, Scotts Valley, CA (US);

Vikash Banthia, Mountain View, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/3065 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01); H01J 37/32 (2006.01); C23C 16/50 (2006.01); C23C 16/458 (2006.01); C23C 16/455 (2006.01); H01L 21/477 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32082 (2013.01); C23C 16/455 (2013.01); C23C 16/458 (2013.01); C23C 16/50 (2013.01); H01J 37/3244 (2013.01); H01J 37/32449 (2013.01); H01J 37/32715 (2013.01); H01L 21/3065 (2013.01); H01L 21/477 (2013.01); H01L 21/67248 (2013.01); H01J 2237/3347 (2013.01);
Abstract

Methods of etching include cycles of low temperature etching of a material layer disposed on a substrate, with at least one of the cycles being followed by activation of unreacted etchant deposits during an inert gas plasma treatment. In some embodiments, a method includes: positioning a substrate in a processing chamber; generating, in a first etching cycle, a plasma from a gas mixture within the processing chamber to form a processing gas including an etchant; exposing, to the etchant, a portion of a material layer disposed on a substrate maintained at a first temperature; generating an inert gas plasma within the processing chamber; generating, in a second etching cycle, a plasma from a gas mixture within the processing chamber to form a processing gas including an etchant; and heating the substrate to a second temperature to sublimate a byproduct of reaction between the etchant and the material layer.


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