The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2019
Filed:
Jan. 09, 2017
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Bong Jun Juhng, Suwon-si, KR;
Doo Young Kim, Suwon-si, KR;
Ki Pyo Hong, Suwon-si, KR;
You Na Kim, Suwon-si, KR;
Hye Young Choi, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/30 (2006.01); H01G 4/248 (2006.01); H01G 13/00 (2013.01); H01G 4/232 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01);
U.S. Cl.
CPC ...
H01G 4/30 (2013.01); H01G 4/232 (2013.01); H01G 4/248 (2013.01); H01G 13/006 (2013.01); H01G 4/012 (2013.01); H01G 4/12 (2013.01);
Abstract
A method of manufacturing a multilayer ceramic electronic component includes forming external electrodes on end surfaces of a ceramic body, and more particularly, to forming external electrodes by attaching a sheet for forming an external electrode on a ceramic body. A multilayer ceramic electronic component thus formed has external electrodes with a thin and uniform thickness.